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2002  Established the first domestic SMD LED packaging lines2005  Approved high power ceramic led patent, package technology and package product2006  DA-epoxy ohmic contact bottom line protection technology and patent2009  TOP LED. Technology improvement of die bounding, Refond was the first to promote the 30mA driven TOP LED2010 LED TV backlight overall solution and products; High power package phosphor coating technology improvement and lens molding technology2011  Promoted TOP LED 4014, 70202012  High power LED phosphor KL graphical coating; Promoted PCT TOP LED2013  High power LED eutectic bonding technology MP application2013  360°emitting package and filament product2014  CSP patent, technology and product solution; Inorganic package technology and product solution, EMC LED MP2015  Refond laboratory got CNAS certification2016  Flip chip on board 3D package technology awarded the first and second prize in national technical inventions.2017  Micro lens production technology and package application solution